In chapter 1, the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data is described. Some challenges with respect to packaging has been discussed in detail and some methods to overcome challenges such as lattice mismatch has been described.
Every electronic components or electronic systems have certain specifications based on which it is developed and all components have datasheets of their own. The datasheets consists complete details related to the product such as product design specifications, packaging type, power ratings, dimensions etc. Any components can be selected for a particular application by referring their datasheets. In chapter 2, a datasheet for a DC power supply has been developed covering most of the important details that may be needed for designing and modeling using software tools. The schematic of the power supply is developed and practical tests are performed on the power supply, which has been described in details with the test results. The power supply has four interfaces and the functionality and usability of these interfaces has been shown and described in detail.
Before the large scale manufacturing and production of any product, it is necessary to conduct two basic tests i.e. Thermal analysis and vibration tests for any given product. These tests help us to get an insight to the reliability of the product. In chapter 3, the power supply is modeled using the software tool ICEPACK v13, using which thermal analysis is performed on the critical components and the temperature variation curves along with the simulation results has been discussed. The method of casing used for the power supply for modeling and the types of conventions i.e. natural and forced convention systems has been compared and discussed. An experimental set up used for performing vibration testing on the power supply has been demonstrated and described in detail.
Inhaltsverzeichnis
Abstract
List of Tables
List of Figures
CHAPTER 1
1. Opto-electronics packaging and Failure Analysis Methodologies
1.1 Recommendations for Opto-electronics packaging design
1.2 Recommendations for Failure Analysis Technique
1.3 Merits and Demerits of Packaging design and failure analysis techniques
1.4 Essential modifications for the improvement and realization of the product
3.5 Conclusion
CHAPTER 2
2. Datasheet development and testing of an electronic product
2.1 Development of data sheet for Linear Power Supply
2.1.1 Product Design Specifications
2.1.2 Brief Introduction to the DC power supply
2.1.3 Packaging Details
2.1.4 Dimensions of the system
2.1.5 Min/Max current, voltage and power ratings
2.2 Schematic Development
2.3 Interfaces Available
2.4 Components details with Cost and Availability
2.5 Test set up and results
2.8 Conclusion
CHAPTER 3
3. Thermal Analysis and Vibration testing of the DC power supply
3.1 Thermal variation of critical components and spacing between the critical components
3.2 Design of casing for power supply and its geometrical parameters
3.3 Design, Modeling and Simulation of mechanical casing for power supply using ICEPACK
3.4 Optimized solution for mechanical casing design to meet the thermal variations
3.5 Experimental set up to carry out vibration analysis for the power supply
3.6 Conclusion
3.6 Module Learning Outcomes
3.7 Summary
REFERENCES
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Upload your own papers! Earn money and win an iPhone X.